IR Cut Filters & Dicing

In 2012, we were contracted to dice ceramic substrates for a major ceramics manufacturer in Japan. We proposed installing our slicing systems and thick material cutting dicers.

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We were contracted to dice ceramic substrates. The client initially shipped machined chips stored in trays, but we proposed taking advantage of our integrated production line to package chips stored in tapes and reels.

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We received an inquiry from a customer who had been purchasing commercial press parts separately and mounting substrates, and who requested information on packaging in taping to reduce time spent mounting. Hearing that the mounting process could not be streamlined for these catalog items, we proposed customizing parts.

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