At TAMA Electronics, we have continued to focus our business on contract machining for semiconductor assembly in the Tama region in Tokyo, since we were founded nearly 40 years ago. Based on our key dicing technology, we began accepting contract machining work for optical parts in the 2000s and transformed into a parts machining contract manufacturer that handles everything from electronics to optical devices. In 2014, we successfully developed the world's thinnest IR cut filter as an original TAMA Electronics product, and we continue to expand our business not only as a contract machining company, but as an electronics and optical parts manufacturer with our own line of products. We are here today thanks to your supporting our stance toward rapidly challenging new business fields and our business stance of flexibly responding to your requests. We will continue to focus all of our efforts on satisfying our customers and on carefully planning how we manage our businesses. We hope that we will continue to enjoy your trust and support.
Trade name | TAMA Electronics Co., Ltd. (changed on June 11, 2009) |
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Location | [HQ] 4-8-3, Nakanokami-cho, Hachioji-shi, Tokyo TEL: 042 (625) 9681 (reception desk) FAX: 042 (625) 6598 |
Established |
December 2016: TAMA Electronics Product Co., Ltd. |
Capital | 10 million yen |
Executives | Takuro Yonemaru, President Yasuhisa Watanabe, Director Shuji Yasui, Director Masaharu Kawamura, Director Akinobu Inoue, Auditor |
Services | Dicing (silicon/glass/ceramic/crystal/other compound materials) Design, manufacturing, and sales of optical filters including evaporation-coated/thin film/film treated IR cut filters and BAG filters * BAG: Blue Absorbing Glass Semiconductor integrated circuit chip selection (lineup/appearance selection) ROM writing (flash memory/microcomputers/OTPs/PLDs/DSPs) Taping services (tape reel storage) Packaging method modification (tray-to-tape reel/stick-to-tape reel/partitioned packaging, etc.) Appearance selection (integrated-circuits/optical filters/other electronic components) Equipment manufacturing contracting (manufacturing contracting/production line contracting) |
Sales | 2017 FY: 356 million yen(6 months) 2018 FY: 762 million yen 2019 FY: 742 million yen 2020 FY: 811 million yen 2021 FY: 902 million yen 2022 FY: 1,027 million yen |
Number of employees | 90 (as of July 1, 2023) |
Major clients | KYOCERA Corporation MTC Co., Ltd. MCM Japan Ltd. Ryosan Company, Limited TOKYO SEIMITSU CO., LTD. MARUWA CO.,LTD. Bsize Inc. Mitsubishi Chemical Corporation Matsunami Glass Ind.,Ltd. Asahi Sangyo Kaisha, Ltd. Toki Commercial Co., Ltd. |
Major suppliers | LINTEC Corporation Asahi Sangyo Kaisha, Ltd. DISCO Inc. |
Banks of account | Resona Bank, Hachioji Branch Mizuho Bank, Hachioji Branch Shoko Chukin Bank, Hachioji Branch |
Certifications | ISO9001 (quality management system): Certified in May 2010 (optical filters) Sony Green Partner: Certified in August 25, 2009 |
Dec. 1979 | Founded as Nichiei Denshi Co., Ltd.; launched IC characteristic selection business |
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March 1990 | Capital increased to 80 million yen |
April 1990 | Name changed to TAMA Okidenki Co., Ltd. |
July 1990 | Completed construction of new plant; launched IC probing business |
Oct. 1993 | Launched linear testing business |
Aug. 1995 | Launched logic testing business |
Dec. 1997 | Launched DRAM testing business |
Oct. 2002 | Launched optical glass business |
Oct. 2004 | Launched optical parts cleaning business and vehicle-mounted impact sensor assembly business |
Nov. 2008 | Name changed to OKI Semiconductor TAMA Co., Ltd. due to M&A |
June 2009 | Name changed to TAMA Electronics Co., Ltd. due to MBO |
May 2010 | Reacquired ISO9001 (quality system) certification |
June 2014 | Installed new evaporation coating line; launched evaporation coating/thin film/film treatment business |
April 2015 | Began designing, manufacturing, and selling IR cut filters (BAG filters) |
Dec. 2015 | Installed new thick material slicing line |
Oct. 2016 | Spin-off TME Future Co., Ltd. |
April 2017 | Spin-off TME NEXT Co., Ltd. |
Oct. 2017 | Business transfer by Spin-off |