IR Cut Filters & Dicing

Yes, you can purchase a single substrate or chip type filter. A standard sized substrate type filter (76 mm × 76 mm, t=0.21 mm) costs 12,000 yen (tax not included). Please contact us for a quote if you are looking for a substrate type filter of a different size or are looking for a chip type filter.

We use D263 due to its impressive results as optical glass, such as strength and resistance to deterioration. If you are interested in other substrates, please contact us.

A thinner filter brings it closer to the sensor, and can help to make the camera modules used in smartphone and other devices smaller and lighter.

Making a filter thinner does indeed increase its curvature. However, our technology keeps curvature within standards thanks to the advanced techniques we apply during our machining process.

We also deal with optical filters other than BAG filters and IR cut filters, from the design simulation stage. Some examples include infrared cut filters and low-pass filters. Please feel free to contact us.

There are vertical packing trays, tape-attached packing, etc. Please feel free to contact us.

Some materials we work with include silicon, SiC (silicon carbide), ceramic, quartz, optical glass, and sapphire. We also handle a variety of dicing methods, such as grooving, bevel cutting, and chamfering. Feel free to contact us with your requirements.

We can arrange substrates upon request.

We accept orders from a single unit.

Please send us the IC model number or product data sheet. We will confirm whether our sockets and ROM writers are compatible with your ICs and get right back to you.

Yes, you can order dry packing only. We can adjust the baking temperature and conditions to suit your specifications. Please feel free to contact us.

We can switch products from a stick to a tape and reel, from tape and reel to a stick, and from tape to tape. Please feel free to contact us.